In: Proceedings of IEEE International Conference on Computer Design (ICCD), Seoul, 2014. An interconnect reliability-driven routing technique for electromigration failure avoidance. Assessment and comparison of different approaches for mask write time reduction. 33–40, Pak J, Yu B, Pan D Z. Electromigration-aware redundant via insertion. OBJECTIVES. Design for Manufacturability (DFM) is a system approach that simultaneously considers all of the design goals and constraints for products that will be manufactured. 121–126, Tang X P, Cho M. Optimal layout decomposition for double patterning technology. Fast dual graph based hotspot detection. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Taipei, 2010. David Z. Pan. Proc SPIE, 2011: 8166, Yuan K, Yu B, Pan D Z. E-Beam lithography stencil planning and optimization with overlapped characters. An efficient layout decomposition approach for triple patterning lithography. However, in order to perform reliably, the board must be well-manufactured. Mask strategy and layout decomposition for self-aligned quadruple patterning. Accurate lithography hotspot detection based on principal component analysis-support vector machine classifier with hierarchical data clustering. Defect probability of directed self-assembly lithography: fast identification and postplacement optimization. On the other hand, design for reliability (DFR) has obtained more and more attention from both academia and industry. Science China Information Sciences This makes it increasingly difficult to satisfy the continuing demand for ever higher reliability of chips. http://www.mentor.com/products, Capodieci L. Beyond 28nm: new frontiers and innovations in design for manufacturability at the limits of the scaling roadmap. Proc SPIE, 2011: 7973, Sahouria E, Bowhill A. Generalization of shot definition for variable shaped e-beam machines for write time reduction. Design for Manufacturability (DFM) — the key to high reliability PCB When it comes to manufacturing printed circuit boards and design for manufacturability- DFM, you want a company with precision equipment, reliable systems to consistently produce a quality product and on … Proc SPIE, 2004, 5567, Kahng A B, Xu X, Zelikovsky A. 25–32, Kodama C, Ichikawa H, Nakayama K, et al. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2015. On soft error rate analysis of scaled CMOS designs: a statistical perspective. Detailed routing for spacer-is-metal type self-aligned double/quadruple patterning lithography. Methodology for standard cell compliance and detailed placement for triple patterning lithography. 83–86, Fang S-Y, Hong Y-X, Lu Y-Z. 357: 6, Fang S-Y, Liu I-J, Chang Y-W. Stitch-aware routing for multiple e-beam lithography. High-level synthesis of error detecting cores through low-cost modulo-3 shadow datapaths. 821–824, Grasser T, Rott K, Reisinger H, et al. When design engineers and manufacturing engineers work together to design and rationalize both the product and production and support processes, it is known as integrated product and process design. 506–511, Yuan K, Lu K, and Pan D Z. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2015. Proc SPIE, 2015: 9427, Taylor B, Pileggi L. Exact combinatorial optimization methods for physical design of regular logic bricks. However, as the transistor feature size is further shrunk to sub-14nm nanometer regime, modern integrated circuit (IC) designs are challenged by exacerbated manufacturability and reliability issues. The paradigm shift in understanding the bias temperature instability: from reaction–diffusion to switching oxide traps. Design for manufacturability (also sometimes known as design for manufacturing or DFM) is the general engineering practice of designing products in such a way that they are easy to manufacture. However, as the transistor feature size is further shrunk to sub-14nm nanometer regime, modern integrated circuit (IC) designs are challenged by exacerbated manufacturability and reliability issues. In: Proceedings of IEEE International Electron Devices Meeting (IEDM), San Francisco, 2014. Design for reliability ensures that products and systems perform a specified function within a given environment for an expected lifecycle. One of the biggest factors is the manufacturability … Triple patterning aware detailed placement toward zero cross-row middle-of-line conflict. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2012. Tax calculation will be finalised during checkout. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2013. It is therefore critical that companies have a design for manufacturability (DfM) protocol in place to mitigate these problems. Aging-aware logic synthesis. To overcome these grand challenges, full-chip modeling and physical design tools are imperative to achieve high manufacturability and reliability. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Diego, 2007. Contact-hole patterning for random logic circuit using block copolymer directed self-assembly. 186–191, Liu C-Y, Chang Y-W. 157–163, Cadence Virtuoso DFM. 61–68, Oboril F, Tahoori M B. ExtraTime: modeling and analysis of wearout due to transistor aging at microarchitecturelevel. 389–391, Ebrahimi M, Oboril F, Kiamehr S, et al. In: Proceedings of IEEE International Reliability Physics Symposium (IRPS), Waikoloa, 2014. Self-aligned double patterning decomposition for overlay minimization and hot spot detection. Design for manufacturability (DFM) is the process of proactively designing products to (1) optimize all the manufacturing functions: fabrication, assembly, test, procurement, shipping, delivery, service, and repair, and (2) assure the best cost, quality, reliability, regulatory compliance, safety, time-to-market, and customer satisfaction. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2012. Predicting variability in nanoscale lithography processes. Meeting the stringent requirements using low-tolerance components and cost constraints demanded of mobile wireless and handset components has required a laser-like focus on long term reliability and design-for-manufacturability (DFM). A Perspective from Design for Reliability and Manufacturability Utilizing Simulations Yan Liu and Scott Hareland Medtronic, Inc. United States 1. In: Proceedings of ACM International Symposium on Physical Design (ISPD), Napa Valley, 2012. 123–129, Hsu P-Y, Chang Y-W. Non-stitch triple patterning-aware routing based on conflict graph pre-coloring. RF performance and environmental requirements are very “unforgiving”. In: Proceedings of ACM International Symposium on Physical Design (ISPD), San Francisco, 2010. Constrained pattern assignment for standard cell based triple patterning lithography. Standard cell layout regularity and pin access optimization considering middle-of-line. 201: 6, Peng H-K, Wen C H-P, Bhadra J. 67–74, Mirsaeedi M, Torres J A, Anis M. Self-aligned double patterning (SADP) layout decomposition. In: Proceedings of IEEE International Reliability Physics Symposium (IRPS), Waikoloa, 2014. 59, 061406 (2016). Effective product development must go beyond the traditional steps of acquiring and implementing product and process design technology as the solution. In: Proceedings of IEEE International Electron Devices Meeting (IEDM), San Francisco, 2012. 396–403, Yu B, Xu X Q, Gao J-R, et al. IEEE Trans Comput Aided Des Integr Circ Syst, 2013, 32: 419–432, Hougardy S, Nieberg T, Schneider J. BonnCell: automatic layout of leaf cells. What Are The Benefits Of Design For Manufacturability. The design of a product and its components, including the raw material, dimensional tolerances and secondary processing, such … Email: rf_mems@wispry.com, Design for Reliability & Manufacturability. 390–395, Liu Z Q, Liu C W, Young E F Y. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Chiba/Tokyo, 2015. Springer, 2015, Reis R, Cao Y, Wirth G. Circuit Design for Reliability. New observations on the hot carrier and NBTI reliability of silicon nanowire transistors. The University of Texas at Austin, 2015, Kumar S V, Kim C H, Sapatnekar S S. NBTI aware synthesis of digital circuits. 390–395, Liu I-J, Chang Y-W. 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